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专利名称：Interconnection structure, electronic
component and method of manufacturingthe same
发明人：Ralf Otremba申请号：US11381550申请日：20060504公开号：US07541681B2公开日：20090602
专利附图：
摘要：An interconnection structure includes an electrically conductive bump, whereinthe electrically conductive bump has a metal body having a distal end. The metal body is
free of solder. An outermost layer of diffusion solder is positioned on at least regions ofthe metal body of the electrically conductive bump.
申请人：Ralf Otremba
地址：Kaufbeuren DE
国籍：DE
代理机构：Banner & Witcoff, Ltd.
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