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专利名称：High-power electronics component and
assembly comprising at least one such high-power electronics component
发明人：BAJAN, LIVIU,EL GHARIB, SAMIR,SCHULTE,
GERRIT
申请号：EP11182462.9申请日：20110923公开号：EP2574157A1公开日：20130327
专利附图：
摘要：The power electronic component has heat sink as cooling structure (2), power
semiconductor module (1) and circuit arrangement (3) for controlling powersemiconductor module. The cooling structure comprises parallel channels for
accommodating flowing coolant. Several adjacent channels form supply channels havingend regions connected by connecting channels, and return channels having start regionsconnected by connecting channels, while start regions of return channels are connectedwith end regions of supply channels. An independent claim is included for electricalarrangement having power electronic component.
申请人：AEG POWER SOLUTIONS B.V.
地址：Weerenweg 29 1161 AH Zwanenburg NL
国籍：NL
代理机构：Graefe, Jörg
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