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专利名称：Electronic component termination and
assembly by means of transient liquid phasesintering metallurgical bond
发明人：John E. McConnell,Garry L. Renner,John
Bultitude
申请号：US15149309申请日：20160509公开号：US09793057B2公开日：20171017
专利附图：
摘要：An improved method for forming a capacitor is provided as is a capacitor, or
electrical component, formed by the method. The method includes providing an
aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathodeon a first portion of the aluminum oxide dielectric; bonding an anode lead to thealuminum anode on a second portion of the aluminum oxide by a transient liquid phasesintered conductive material thereby metallurgical bonding the aluminum anode to theanode lead; and bonding a cathode lead to said cathode.
申请人：Kemet Electronics Corporation
地址：Simpsonville SC US
国籍：US
代理机构：Perkins Law Firm, LLC
代理人：Joseph T. Guy
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