专利内容由知识产权出版社提供
专利名称：ASSEMBLED STRUCTURE OF ELECTRONIC
COMPONENT AND HEAT-DISSIPATINGDEVICE
发明人：Ming-Tang Yang申请号：US13103021申请日：20110506
公开号：US20120069525A1公开日：20120322
专利附图：
摘要：An assembled structure includes an electronic component, a heat-dissipatingdevice and a stepped isolation member. The electronic component has a first perforation.
The heat-dissipating device has a second perforation corresponding to the first
perforation of the electronic component. The stepped isolation member includes a firstsegment, a second segment and a third segment. The outer diameter of the firstsegment is smaller than the outer diameter of the second segment, and the outerdiameter of the second segment is smaller than the outer diameter of the third segment.The first segment is partially accommodated within the first perforation of the electroniccomponent, the second segment is arranged between the first segment and the thirdsegment and engaged with the second perforation of the heat-dissipating device, and thethird segment is contacted with the heat-dissipating device.
申请人：Ming-Tang Yang
地址：Taoyuan Hsien TW
国籍：TW
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