专利内容由知识产权出版社提供
专利名称：Low coefficient of thermal expansion
bonding system for a high porosity ceramicbody and methods of manufacture
发明人：James Jenq Liu,Bilal Zuberi申请号：US12015103申请日：20080116公开号：US07855163B2公开日：20101221
摘要：A porous ceramic body comprises a plurality of fibers and a bonding systembonding a portion of at least two fibers of the plurality of fibers. The plurality of fibershas a first coefficient of thermal expansion. The bonding system has a second coefficientof thermal expansion lower than the first coefficient of thermal expansion. In someembodiments, when the plurality of fibers and the bonding system are combined theresulting porous ceramic body has a third coefficient of thermal expansion which is atleast about 10% less than the first coefficient of thermal expansion.
申请人：James Jenq Liu,Bilal Zuberi
地址：Mason OH US,Cambridge MA US
国籍：US,US
更多信息请下载全文后查看
