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专利名称：Apparatus and method for sequentially
polishing and loading/unloadingsemiconductor wafers
发明人：In Kwon Jeong申请号：US11713784申请日：20070305
公开号：US200800392A1公开日：20080214
专利附图：
摘要：A chemical mechanical polishing (CMP) apparatus and method for polishingsemiconductor wafers utilizes multiple wafer carriers that are transferred to different
positions about a polishing pad to polish at least one semiconductor wafer while anothersemiconductor wafer is being loaded onto or unloaded from one of the wafer carriers.The different positions include multiple polishing positions and one or more
loading/unloading positions. In some embodiments, the CMP apparatus is configuredsuch that a semiconductor wafer is polished at a loading/unloading position. The CMPapparatus may also be configured to continuously polish one or more semiconductorwafers while the wafer carriers are being transferred to different positions. Thus, theCMP apparatus can continuously process the semiconductor wafers without significantidle periods. Consequently, in these embodiments, the efficiency of the CMP apparatus issignificantly increased. Furthermore, the wafer carriers of the CMP apparatus arepreferably restricted to a small area to decrease the footprint of the apparatus.
申请人：In Kwon Jeong
地址：Sunnyvale CA US
国籍：US
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