专利内容由知识产权出版社提供
专利名称：SENSING DEVICE AND METHOD FOR
MANUFACTURING SENSING DEVICE
发明人：IKEDA, Yukio申请号：EP14811221.2申请日：20140609公开号：EP3009802B1公开日：20180328
摘要：Provided are: a sensing device which is able to be suppressed in decrease ofsensing accuracy of a sensor due to heat during resin molding of the sensor; and amethod for manufacturing a sensing device. A sensor module (3) is provided with: amagnetic field sensor (4) that comprises a sensor main body (40) containing a magneticfield sensing element (40a) and a plurality of lead wires (41) led out from the sensor mainbody (40); a container case (31) having a container part (31A) that contains the sensormain body (40); and a mold molded body (32) that is formed of a mold resin molded soas to contain at least a part of the container case (31) without coming into contact withthe sensor main body (40).
申请人：HITACHI METALS LTD
地址：JP
国籍：JP
代理机构：Intès, Didier Gérard André
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