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专利名称：Electrical microfilament to circuit interface发明人：Stephen C. Jacobsen,David P.
Marceau,Shayne M. Zum,David T. Markus
申请号：US13213001申请日：20110818公开号：US08217269B2公开日：20120710
专利附图：
摘要：Devices and methods for electrical interconnection for microelectronic circuitsare disclosed. One method of electrical interconnection includes forming a bundle ofmicrofilaments, wherein at least two of the microfilaments include electrically conductive
portions extending along their lengths. The method can also include bonding the
microfilaments to corresponding bond pads of a microelectronic circuit substrate to formelectrical connections between the electrically conductive portions and thecorresponding bond pads. A microelectronic circuit can include a bundle of
microfilaments bonded to corresponding bond pads to make electrical connectionbetween corresponding bonds pads and electrically-conductive portions of themicrofilaments.
申请人：Stephen C. Jacobsen,David P. Marceau,Shayne M. Zum,David T. Markus
地址：Salt Lake City UT US,Salt Lake City UT US,Salt Lake City UT US,Salt Lake City UTUS
国籍：US,US,US,US
代理机构：Thorpe North & Western LLP
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